IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards.
Featured Documents
IPC-6012 Standard Only
The base standard that establishes the guidance for building and manufacturing better electronics.
IPC-6012 Amendment
Amendments have to be used in conjunction with the base standard that they are amending.
IPC-6012 Addendum
Addendums provide industry specific guidance that build on top of the guidance provided by the base standard, and they have to be used in conjunction with the base standard.
IPC-6012 Addendum with amendment(s)
Amendment to an addendum, has to be used with the addendum in conjunction with the base standard and addresses a specific change in the addendum.
IPC-6012 Redline Standard
Redline standards provide a side-by-side comparison of what has changed between revisions.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards