Products
Amendment 1 to IPC-4202A modifies the standard by correcting editorial errors; converts metric dimensional units of measure to those commonly used throughout industry; describes the flammability method of test and requirements for very thin materials (VTM); and corrects property requirement errors in all nine specification sheets contained in this standard.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards