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The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards