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This survey-based study about the current state of the the North American PCB industry covers data for 2016 and the first half of 2017 from IPC's PCB Statistical Program. It includes market size estimates, sales and production growth, sales by product type, product mix (e.g, prototype), vertical markets, revenue per employee, capacity utilization, inventory turns, lead times, US PCB imports and...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards