Products
The IPC APEX EXPO 2024 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.
The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging...
The IPC APEX EXPO 2023 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.
The IPC APEX EXPO 2022 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly, as well as technical papers on Factory of the Future.
The 2018 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from the technical conference include: 70 presentations from 28 sessions, 24 poster papers and 5 buzz session presentations. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics, Design...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards