Product Details
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.
Published Date
ISBN
978-1-63816-170-7
Pages
22
DoD Adopted
No
ANSI Approved
No