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Released: 02/12/2007

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English

This is a three-page list of common terms and definitions use when discussing solder reflow processes and equipment.

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

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IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly