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Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards