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IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for...
IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means. IPC-J-STD-001H is a must-have for those...
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J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B: Metal Foil for Printed Board Applications
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards