Standards: Other Standards: Lead Free

344 Products

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics



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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies



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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...



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IPC/WHMA-A-620C: IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies



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IPC/WHMA-A-620C: Requirements and Acceptance for Cable and Wire Harness Assemblies



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IPC-7711/21C-电子组件的返工、修改和维修



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IPC-4550-FAM: Plating Specifications



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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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PtdEleFAM: Printed Electronics Family



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SolMatFAM: Solder Materials Family



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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求



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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求



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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定



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IPC-9241: Guidelines for Microsection Preparation



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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定



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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards