Standards: Other Standards: Lead Free

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IPC-9241: Guidelines for Microsection Preparation



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IPC-A-610F-AM1: Acceptabilitatea Ansamblurilor Electronice Amendament 1



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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准



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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准



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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)



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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)



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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1



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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1



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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés



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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques



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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite



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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1



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IPC-A-610F-SE: Acceptanskrav för kretskort



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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1



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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试



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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级