Products
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...
IPC/WHMA-A-620E is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620E describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620E was developed by IPC and...
The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1...
The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.
The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...
IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...
While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR) which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a...
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface...
The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions...
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications.
Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
The IPC-A-610HC Telecom Addendum to IPC-A-610H Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision H by providing additional requirements to ensure that electrical and...
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...
IPC-A-610G-R rail transit addendum provides additional requirements to IPC-A-610G base standard, specifying a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-environment under high mechanical and environmental stresses associated with high railway equipment, to ensure industry-specific high reliability and environmental adaptability of electronic...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards