Your results
- 3
Language
Products
The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards