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This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible and rigid base dielectric materials for manufacture of printed electronics. It includes base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards