IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages. Released November 1996.
Included in the IPC- C-103 and the IPC- C-1000 Collections.
Product ID: 3408-STD-0-D-0-EN-0