SINGLE DEVICE DOWNLOAD
Release Date
SKU: 3408-STD-0-D-0-EN-0
Note:
This is a non-printable product.
Nonmember price: $103.00
Member price: $62.00
Your price: $103.00

Product Details

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. 25 pages. Released November 1996.

Published Date
Pages
15
DoD Adopted
No
ANSI Approved
No