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IPC-2591

IPC-2591: Connected Factory Exchange (CFX)

IPC-2591, CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

Featured Documents

IPC-2591 Standard Only

Results: 14

The base standard that establishes the guidance for building and manufacturing better electronics.

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IPC-2221C: Generic Standard on Printed Board Design

J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610J: Acceptability of Electronic Assemblies

IPC-4922: Requirements for Sintering Materials for Electronics Assembly

IPC-6012F: Qualification and Performance Specification for Rigid Printed Boards

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

IPC/WHMA-A-620E-S: Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.

IPC-1782B: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

IPC-4562B: Metal Foil for Printed Board Applications

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-7711/21D: Rework, Modification and Repair of Electronic Assemblies

IPC-1791D: Trusted Electronic Designer, Fabricator and Assembler Requirements

J-STD-004D: Requirements for Soldering Fluxes