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Latest releases

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IPC-J-STD-001HA/A-610HA: IPC J-STD-001H はんだ付される電気および電子組立品、およびIPC-A-610H 電子組立品の許容基準：車載用途向け追加規格

Released

06/22/2022

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IPC/WHMA-A-620CR: 线缆及线束组件的要求与验收轨道交通补充标准Rail Transit Addendum to IPC/WHMA-A-620C

Released

06/22/2022

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IPC-J-STD-001HS: Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001H Anforderungen an gelötete elektrische und elektronische Baugruppen

Released

06/22/2022

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IPC-HDBK-9798: Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Released

06/21/2022

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IPC-6012EA: 刚性印制板的鉴定及性能规范汽车应用补充标准

Released

06/14/2022

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IPC/WHMA-A-620D: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây Điện và Cáp Điện

Released

06/14/2022

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IPC-J-STD-001HS: 焊接的电气和电子组件要求航天和军事应用电子部件补充标准

Released

06/14/2022

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IPC-6012EA: リジッドプリント板の認定および性能仕様車載用途向け追加規格

Released

06/14/2022

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IPC-J-STD-001HS: Suplemento del IPC J-STD-001H Requisitos para Ensambles Eléctricos y Electrónicos Soldados para Aplicaciones Espaciales y Militares de Dispositivos Electrónicos

Released

06/08/2022

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IPC-A-640A: Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

Released

05/31/2022

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IPC/WHMA-A-620CR: Rail Transit Addendum to IPC/WHMA-A-620C

Released

05/31/2022

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IPC-J-STD-001H: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

Released

05/31/2022

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IPC-6013E: 挠性和刚挠印制板的鉴定及性能规范

Released

05/31/2022

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IPC-A-610GR: Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies

Released

05/31/2022

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IPC-4555: Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Released

05/31/2022

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IPC-A-53 Revision C, Surface Insulation Resistance Test Board

Released

05/31/2022

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IPC-D-640A: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

Released

05/31/2022

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IPC-J-STD-001H: Krav til loddede elektriske og elektroniske produkter

Released

05/04/2022

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IPC-T-51: Terms and Definitions for Design and Manufacture of Printed Electronics

Released

05/04/2022

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IPC-7093A: 下面電極部品(BTC)の設計および組立プロセスの実施

Released

05/03/2022

IPC-6012E-AM1 Cover Image

IPC-6012E-AM1: Qualification and Performance Specification for Rigid Printed Boards

Released

04/20/2022

IPC-9121A Cover Image

IPC-9121A: Troubleshooting for Printed Board Fabrication Processes

Released

04/14/2022

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IPC-WP-019B: 综述全球离子洁净度要求的变更

Released

04/13/2022

IPC-Hermes-9852 V 1.4 Cover Image

IPC-Hermes-9852-Version 1.4: The Global Standard for Machine-to-Machine Communication in SMT Assembly

Released

04/13/2022

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IPC-2222B: 刚性有机印制板设计分标准

Released

04/13/2022

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IPC-A-610H: Kritéria přijatelnosti elektronických sestav

Released

04/12/2022

IPC-7526A Cover Image

IPC-7526A: Stencil and Misprinted Board Cleaning Handbook

Released

04/12/2022

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IPC-6013EM: Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Released

04/12/2022

IPC-A-610H RO Cover Image

IPC-A-610H: Acceptabilitatea Ansamblurilor Electronice

Released

04/12/2022

IPC-A-610H Hungarian cover image

IPC-A-610H: Elektronikai szerelvények elfogadhatósága

Released

04/12/2022

IPC-9701B Cover Image

IPC-9701B: Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Released

04/12/2022

Coming Soon

IPC-7526A: Stencil and Misprinted Board Cleaning Handbook

IPC-7091A: Design and Assembly Process Implementation of 3-D Components

IPC-7092A: Design and Assembly Process Implementation for Embedded Circuitry and Devices

IPC-5262: Design, Critical Process and Acceptance Requirements for Polymeric Applications

IPC-4592: Requirements for Printed Electronics Functional Dielectric Materials

IPC-9701B: Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

IPC-7525C: Stencil Design Guidelines

IPC-D-640A: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies

IPC-4412C: Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

J-STD-003D: Solderability Tests for Printed Boards

IPC/DAC-2552: International Standard for Model Based Design (MBD) for Digital Twin Factories

IPC-T-51: Terms and Definitions for the Design and Manufacture of Printed Electronics

IPC-2591, Version 1.5: Connected Factory Exchange (CFX)

IPC-6018DS: Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-7801A: Reflow Oven Process Control Standard