IPC-J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
The IPC-J-STD-001 standard provides guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.
IPC-J-STD-001 Standard with amendment(s)
When an amendment to a standard is released, it is often made available with the base standard. Look here if you need both the amendment and the base standard.
IPC-J-STD-001 Standard Only
The base standard that establishes the guidance for building and manufacturing better electronics.
Amendments have to be used in conjunction with the base standard that they are amending.
Addendums provide industry specific guidance that build on top of the guidance provided by the base standard, and they have to be used in conjunction with the base standard.
IPC-J-STD-001 Addendum with amendment(s)
Amendment to an addendum, has to be used with the addendum in conjunction with the base standard and addresses a specific change in the addendum.
IPC-J-STD-001 Redline Standard
Redline standards provide a side-by-side comparison of what has changed between revisions.
IPC-7352: Generic Guideline for Land Pattern Design
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
J-STD-005B: Requirements for Soldering Pastes
IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing