IPC-J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
The IPC-J-STD-001 standard provides guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.
Featured Documents
IPC-J-STD-001 Standard with amendment(s)
When an amendment to a standard is released, it is often made available with the base standard. Look here if you need both the amendment and the base standard.
IPC-J-STD-001 Standard Only
The base standard that establishes the guidance for building and manufacturing better electronics.
IPC-J-STD-001 Amendment
Amendments have to be used in conjunction with the base standard that they are amending.
IPC-J-STD-001 Addendum
Addendums provide industry specific guidance that build on top of the guidance provided by the base standard, and they have to be used in conjunction with the base standard.
IPC-J-STD-001 Addendum with amendment(s)
Amendment to an addendum, has to be used with the addendum in conjunction with the base standard and addresses a specific change in the addendum.
IPC-J-STD-001 Redline Standard
Redline standards provide a side-by-side comparison of what has changed between revisions.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards