IPC-7711/21: Rework, Modification and Repair of Electronic Assemblies
This guide provides procedures for rework, repair and modification of printed board assemblies.
Featured Documents
IPC-7711/21 Standard Only
The base standard that establishes the guidance for building and manufacturing better electronics.
IPC-7711/21 Amendment
Amendments have to be used in conjunction with the base standard that they are amending.
IPC-7711/21 Update
IPC-7711/21 Redline Standard
Redline standards provide a side-by-side comparison of what has changed between revisions.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards