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Document #:

IPC-BMK

Revision

2022

Product Type

Industry Report

Released: 08/15/2022

Language

English

Current Revision

The 2022 Quality Benchmarks for the Electronics Assembly Industry is a biennial report released by IPC. The report represents the findings from an online quantitative survey fielded between the dates of September 28, 2001 – October 20, 2021. A total of 59 assembly companies completed the survey, representing both contract electronics manufacturing services (EMS) companies and original equipment...

Document #:

IPC-ANEMS

Revision

2019

Product Type

Industry Report

Language

English

Current Revision

The 2019 Annual Report & Forecast for the North American EMS Industry is based on data collected from IPC’s EMS statistical program and includes a five-year market forecast from New Venture Research. It covers market sizes, potential for market growth, sales and order growth, sales by product type, vertical markets, order backlogs, domestic production and number of EMS facilities. Management data...

Document #:

IPC-TT

Revision

2016

Product Type

Industry Report

Released: 05/04/2017

Language

English

Current Revision

Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...

Document #:

IPC-I3-PCB

Revision

Product Type

Intelligence Subscription

Language

English

Current Revision

IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American PCB Statistical Program aggregates industry data covering sales, orders and growth rates by product types and company-size tiers for rigid PCBs and by product types for flexible circuits, as well as separate rigid and flex book-to-bill ratios. Backlogs, inventory...

Document #:

IPC-I3-EMS

Revision

Product Type

Intelligence Subscription

Language

English

Current Revision

IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American EMS Market Statistical Program aggregates industry data covering EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, and 3-month and 12 month sales outlook...

Document #:

IPC-SKILLSGAP

Revision

2017

Product Type

Industry Report

Released: 04/20/2017

Language

English

Current Revision

Findings from a 2017 IPC survey of U.S. electronics assembly manufacturers on the impact of the skills gap covers hard-to-fill production and professional positions, reasons applicants did not qualify, and essential skills in short supply. Published April 2017. 31 pages

Document #:

IPC-Roadmap-15

Revision

Original Version

Product Type

Roadmap

Released: 02/20/2015

Language

English

Current Revision

The IPC 2015 International Technology Roadmap provides vision and direction for product and process development and the services required to satisfy current and future needs of companies that design, build, buy or specify electronic equipment and materials. The IPC Roadmap is an invaluable resource for any person or company in or having interest in the global electronics supply chain. It is an...

Document #:

IPC-WAGE

Revision

2022

Product Type

Industry Report

Released: 10/25/2022

Language

English

Current Revision

Th 2022 Wage Rate & Salary Study for the North American Electronics Assembly Industry contains the results of IPC's biennial wage survey in which 30 U.S. companies participated, including both contract manufacturers/EMS companies and OEMs. It shows the data in averages and average ranges on 2022 hourly wages, annual salaries, and sales compensation in the USA. Salary budget growth and pay...

Document #:

IPC-I3-SOLDER

Revision

Product Type

Intelligence Subscription

Language

English

Current Revision

IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. IPC’s Global Solder Statistical Program aggregates industry data covering the volume of solder consumption by product type and by regional market, with quarterly growth rates and a lead-free breakdown, as well as percentages of lead-free solder using SAC alloys. Three-month and 12...

Document #:

IPC-MIL

Revision

Original Version

Product Type

Roadmap

Released: 01/18/2012

Language

English

Current Revision

"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more...

Document #:

IPC-ANPCB

Revision

2017

Product Type

Industry Report

Released: 09/18/2017

Language

English

Current Revision

This survey-based study about the current state of the the North American PCB industry covers data for 2016 and the first half of 2017 from IPC's PCB Statistical Program. It includes market size estimates, sales and production growth, sales by product type, product mix (e.g, prototype), vertical markets, revenue per employee, capacity utilization, inventory turns, lead times, US PCB imports and...

Document #:

IPC-PCBPROTOTYPE

Revision

2017

Product Type

Industry Report

Released: 10/16/2017

Language

English

Current Revision

This report shows trends in PCB prototype sales and growth based on data from IPC's North American PCB Statistical Program covering 2014 through mid-2017. Data on prototype sales percentages by month compared to regular-production PCB sales, and estimates of North American prototype market sizes, are reported for all PCBs as well as for rigid PCBs and flexible circuits separately. The vertical...

Document #:

IPC-BMK

Revision

2019

Product Type

Industry Report

Released: 07/31/2019

Language

English

Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products...

Document #:

IPC-WPCB

Revision

2016

Product Type

Industry Report

Released: 09/12/2017

Language

English

This annual IPC report offers consensus estimates of PCB (bare board) production value by country and by product type, and commentary on global and regional PCB industry trends, developed by a team of the industry's leading analysts. It also contains historical data on regional PCB production trends. This year's report includes a special report on trends in high-speed data communications and its...

Document #:

IPC-BMK

Revision

2017

Product Type

Industry Report

Released: 10/03/2017

Language

English

This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Electronics assembly companies can use this report to compare their performance to industry averages. The survey sample includes 89 contract electronics manufacturers and OEMs in...