Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties (thickness, layer count, heat dissipation, tolerances), miniaturization (line width and spacing, I/O pitch, via diameters, aspect ratios, via structure, etc.), materials (rigid, flexible, stretchable, metal core, reinforcement, thermal properties, loss characteristics, lead-free, halogen-free, surface finishes, etc.), special structures (embedding, optical channels, chip packages, etc.), printed electronics usage (types, processes, applications and use of 3D printing), traceability, compliance and technical challenges, and general trends. 237 page. Published in April 2017.