The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the "how-to" and "why" behind many of the criteria in an easy-to-use reference handbook
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This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections...
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...
This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards for identification of anomalies that are sometimes seen during inspection and evaluation processes. The handbook has been divided into fourteen distinct sections covering topics such as solder resist, plated-through holes, conductor characteristics and surface plating to...
UPDATED with Amendment 1! A comprehensive cross-reference and comparison of Revisions B - C - D is provided.This handbook provides IPC-A-610 change history and cross reference support along with the previous Rev B to C content. IPC-HDBK-610 with Amendment 1 has summary listings of changes from Rev C to D and retains the original Rev B to C content. It offers explanatory and tutorial information to...
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
This document helps establish guidance for the formation of due diligence programs for supply chain conflict minerals tracking, management, disclosure and reporting. This document is not, and should not be used as, a guide to legal compliance with Section 1502 of the Dodd-Frank Act. This document is intended to provide a guide for establishing and implementing a conflict minerals program to meet...
This document provides an overview of the Registration, Evaluation, and Authorization of Chemicals regulation that will impact the electronics interconnect industry. Specifically, this document provides an Executive Overview, a timetable of activities and a review of the implications and obligations for each segment of the supply chain. 27 pages. Released October 2008.
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in...
This handbook is a companion reference to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. It describes materials, methods, and verification criteria that, when applied as recommended or required, will produce quality soldered electrical and electronic assemblies. The intent of the Handbook is to explain the ‘‘how-to,’’ the ‘‘why,’’ and fundamentals for these processes...