Study/Technical Report

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Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Released: 08/04/2020

Language

English

Current Revision

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...

Document #:

IPC-TR-583

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2002

Language

English

Current Revision

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

Document #:

IPC-TR-464

Revision

Original Version

Product Type

Study/Technical Report

Released: 04/01/1987

Language

English

Current Revision

This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.

Document #:

IPC-T800

Revision

2017

Product Type

Study/Technical Report

Language

English

Current Revision

The 2017 North American Cable Assembly Manufacturers report includes company name, address, phone number, business manager, website, estimated 2015 worldwide revenues, facility size, manufacturing locations by region of the world, markets served, product types manufactured, agency approvals/certifications, minority business designations, and a brief description of the business. Nonmember pricing...

Document #:

IPC-P799

Revision

2019

Product Type

Study/Technical Report

Language

English

Current Revision

2019 World Cable Assembly Market, a new research report from industry leader Bishop & Associates, addresses the growth markets and regions and much more. This 17-chapter, 219-page report provides a detailed analysis of the cable assembly market by region, end-use equipment sector, and cable assembly type in US dollars for the years 2018 through 2024. Analysis is provided numerically and...

Document #:

IPC-TP-1113

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/1994

Language

English

Current Revision

A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994

Document #:

IPC-TR-467

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/01/1996

Language

English

Current Revision

This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

Document #:

IPC-TR-465

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/1996

Language

English

Current Revision

Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.

Document #:

IPC-TR-001

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/2006

Language

English

Current Revision

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

Document #:

IPC-TR-579

Revision

Original Version

Product Type

Study/Technical Report

Released: 09/01/1988

Language

English

Current Revision

Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

Document #:

IPC-TR-486

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2001

Language

English

Current Revision

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

Document #:

IPC-TR-549

Revision

Original Version

Product Type

Study/Technical Report

Released: 12/02/2014

Language

English

Current Revision

An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.

Document #:

IPC-TR-585

Revision

Original Version

Product Type

Study/Technical Report

Released: 05/01/2006

Language

English

Current Revision

This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...

Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Language

English

Current Revision

Document #:

IPC-TR-582

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/02/2018

Language

English

Current Revision

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

Document #:

IPC-TR-586

Revision

Original Version

Product Type

Study/Technical Report

Released: 03/01/2009

Language

English

This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...

Document #:

IPC-TR-464

Revision

Original Version

Product Type

Study/Technical Report

Released: 04/01/1984

Language

English

This technical report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 21 Pages. Released April 1984. IPC-TR-464 Addendum The addendum to IPC-TR-464 represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report...