IPC-Benchmark Study 2017
Study of Quality Benchmarks for Electronics Assembly 2017 - Single User Download

This survey-based study covers production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Electronics assembly companies can use this report to compare their performance to industry averages. The survey sample includes 89 contract electronics manufacturers and OEMs in North America, Europe and Asia with total sales revenue ranging from under $10 million to more than $500 million. Aggregate data are segmented by company size tier, region and type of production, including rigid PCBs, flexible circuits, rigid backplanes, end products, mechanical assembly, cable and harness, and discrete wiring terminals and connectors. 146 pages. Released September 2017

Published Date
DoD Adopted
ANSI Approved