SINGLE DEVICE DOWNLOAD
Release Date
SKU: 7526-HB-0-D-0-EN-0
Note:
This is a non-printable product.
Nonmember price: $0.00
Member price: $0.00
Your price: $0.00

Product Details

Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of defects. The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes.

Published Date
Pages
32
DoD Adopted
No
ANSI Approved
No