SINGLE DEVICE DOWNLOAD
Release Date
SKU: D279-STD-0-D-0-EN-0
Note:
This is a non-printable product.
Nonmember price: $183.00
Member price: $110.00
Your price: $183.00
MULTI-DEVICE DOWNLOAD
Release Date
SKU: D279-STD-0-MDL-0-EN-0
Note:
This is a non-printable product.
Nonmember price: $183.00
Member price: $110.00
Your price: $183.00
Seats

Product Details

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.

Published Date
Pages
150
DoD Adopted
No
ANSI Approved
No