This is a list of reported errata to the printed copies of IPC/ECA J-STD-002D. Pen and ink changes should be made in accordance with your company's document control policies.
IPC-7352: Generic Guideline for Land Pattern Design
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
IPC-2591, Version 1.6: Connected Factory Exchange (CFX)
J-STD-005B: Requirements for Soldering Pastes
IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-1791C: Trusted Electronic Designer, Fabricator and Assembler Requirements