Current Revision
2017 Benchmark Study19

IPC-Study of Quality Benchmarks for Electronics Assembly 2019

Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products can use this report to compare their performance to industry averages. Medians, and percentile data are also reported. The survey sample includes 57 contract electronics manufacturers and OEMs worldwide with total sales revenue ranging from under $10 million to more than $1 billion. Aggregate data are segmented by company size tier, region and type of production, including rigid PCBs, flexible circuits, finished end products or systems, mechanical assembly, cable and harness, and discrete wiring terminals and connectors. Released July 2019

Published Date
DoD Adopted
ANSI Approved