The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552 standard defines the set of specification elements for components and parts to be assembled and connected onto printed boards. These specification elements mainly cover the component specifications in strong correlation with board-level manufacturing (e.g., SMT, THT, Press-Fit), assembly and board-level reliability