Current Revision

IPC-7525B

IPC-7525B: Stencil Design Guidelines

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Published Date
ISBN
978-1-61193-020-7
Pages
14
DoD Adopted
No
ANSI Approved
No