Current Revision

IPC-HM-860: Specification for Multilayer Hybrid Circuits

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

Published Date
DoD Adopted
ANSI Approved