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IPC-HDBK-4691 - Handbook

Handbook on Adhesive Bonding in Electronic Assembly Operations

Document #:
IPC-HDBK-4691
Revision
Original Version
Product Type
Handbook
Released:  01/20/2016
Language
English
Current Revision
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
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IPC-CMDDGUIDE - Handbook

Conflict Minerals Due Diligence Guide

Document #:
IPC-CMD
Revision
Original Version
Product Type
Handbook
Released:  02/07/2013
Language
English
Current Revision
This document helps establish guidance for the formation of due diligence programs for supply chain conflict minerals tracking, management, disclosure and reporting. This document is not, and should not be used as, a guide to legal compliance with Section 1502 of the Dodd-Frank Act. This document is intended to provide a guide for establishing and implementing a conflict minerals program to meet...
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Reach Guide 8 - Handbook

REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to Survive

Document #:
REACH-Guide 8
Revision
8
Product Type
Handbook
Released:  10/27/2008
Language
English
Current Revision
This document provides an overview of the Registration, Evaluation, and Authorization of Chemicals regulation that will impact the electronics interconnect industry. Specifically, this document provides an Executive Overview, a timetable of activities and a review of the implications and obligations for each segment of the supply chain. 27 pages. Released October 2008.
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IPC-HDBK-4691 - Handbook

电子组件操作用粘合剂粘接手册

Document #:
IPC-HDBK-4691
Revision
Original Version
Product Type
Handbook
Released:  01/14/2021
Language
Chinese
Current Revision
本手册的目的是帮助那些必须选择粘合剂粘接或从事粘合剂粘接操作的个人，还为仅涉及电子组装的粘合剂粘接的设计、选型和使用提供指导。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly