Products
Developed by the OEM council of the IPC, IPC-1720A categorizes electronic assembly manufacturer capabilities and supplies the OEM customer with detailed, substantive information. This program simplifies auditing processes and reduces the frequency of audits, thereby decreasing paperwork and improving efficiency. Company and Site Description, Site Capability Snap Shot, Equipment Profile (Pre-site...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards