Products
This standard specifies the XML schema that represents the intelligent data file format used to describe administration information related to ordering and specifying printed boards, printed board assemblies, fixtures, and components. The format is a convergence of the Valor Computerized Systems ODB++ and IPC-2511B GenCAM® format structure in XML schema. IPC-2581 is a mandatory part of this...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards