Products
Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry Amendment 1 to IPC-4204A modifies the standard by replacing five sections in the document (sections: 1.1.2 Specific Designation; 2.1 IPC; 2.5 ISO; 3.5.2 Wrinkles, Creases, Streaks and Scratches; and 3.9 Electrical Requirements) to clarify the meanings of these sections.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards