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This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...
本规范规定了使用化学镍/钯/浸金(ENEPIG)作为印制板表面处理的要求。本规范规定了ENEPIG应用于焊接、金属线键合和接触面涂覆层的沉积厚度规格。本规范适用于化学药水供应商、印制板制造商、电子制造服务业(EMS)和原始设备制造商(OEM)。ENEPIG是沉积在以铜为基底金属上的一个三层的表面处理。它是一种多功能的表面处理,适用于焊接和金、铝和铜金属线键合。它也适合作为软薄膜和钢凸圆接触的配合表面。其它应用包括使用低插入力(LIF)和零插入力(ZIF)板边连接器和压入式应用。化学钯层形成的扩散阻挡层,阻碍镍扩散到金表面。浸金防止钯层在加工前与污染物反应,否则可能会影响连接制程,如金属线键合和焊接。全文共82页,2013年发布。2018年10月翻译。
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
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