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IPC-6013E Cover Image

Document #:

Revision

E

Product Type

Released: 09/16/2021

Language

English

Current Revision

IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final...

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Document #:

Revision

E

Product Type

Released: 05/31/2022

Language

Chinese

Current Revision

涵盖根据 IPC-2221 和 IPC-2223 设计的挠性印制板的鉴定和性能要求。挠性印刷板可以是单面、双面、多层或刚挠性多层。所有这些结构都可以包括增强板、镀覆孔、微导通孔和盲孔/埋孔。修订版 E 包含了对最终涂覆、刚挠过渡区、外来夹杂物、表面贴装焊盘异常、电镀内层、褶皱、折痕和吸管状空隙等形变异常，标记，重合度（孔环），导体厚度减小，孔壁介质去除，树脂去除，微孔填镀和孔选择性（钮扣）镀等、铜填充通孔结构微导通孔结构的新增和更新要求。

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

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J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly