IPC-7092 Standard Only | IPC Store

Close

Contact IPC

Products

Document #:

Revision

Original Version

Product Type

Released: 01/20/2020

Language

Chinese

Current Revision

本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Speciﬁcation for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly