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This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards