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This standard supersedes SMEMA 1.2. The purpose of this standard is to provide an equipment interface specification for board transfer manufacturing systems of surface-mounted printed circuit boards. This specification provides the minimum requirement that conveyor-to-conveyor equipment shall meet for both mechanical and electrical requirements, as well as adding dual-lane configuration...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards