This single-sided (4 up) pattern is used for evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also...
IPC-7352: Generic Guideline for Land Pattern Design
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
J-STD-005B: Requirements for Soldering Pastes
IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-1782B: Standard for Manufacturing and Supply Chain Traceability of Electronic Products