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This double-sided test board has ten SIR test patterns which were designed for the IPC cleanliness test program, Phase 1 to examine the ability of a cleaning solvent to remove flux residues and the effects of entrapped residues under low standoff components. The PCB-B-36 test board can be used as a process qualification vehicle for the J-STD-001 which references IPC-9201. The test patterns consist...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards