The Phoenix test board can be used as an alternate to the IPC-B-24 for evaluating the interacton of solder flux and solder paste residues on printed boards. It is specifically useful for IPC/Belcore correlation studies. It is available in electronic format only (Gerber).
IPC-7352: Generic Guideline for Land Pattern Design
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
J-STD-005B: Requirements for Soldering Pastes
IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-1782B: Standard for Manufacturing and Supply Chain Traceability of Electronic Products