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The 2018 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from the technical conference include: 70 presentations from 28 sessions, 24 poster papers and 5 buzz session presentations. Advanced Technology, Area Array/Flip Chip/0201, Assembly Processes, BGA Packaging, Black Pad, Business & Supply Chain Issues Counterfeit Electronics, Design, Electromigration, Electronics Manufacturing Services Embedded Passive & Active Devices Environmental Compliance, Lean Six Sigma Flexible Circuitry HDI Technologies, High Speed, High Frequency & Signal Integrity, Lead Free Fabrication, Assembly & Reliability, Microminiaturization Nanotechnology Optoelectronics Packaging & Components, PCB Fabrication, PCB Storage & Handling Performance, Quality & Reliability Photovoltaics, Printed Electronics, RFID Circuitry, Soldering, Surface Finishes, Test, Inspection & AOI, Tin Whiskers, Via Plugging, Cable and Wire Harness Workmanship & Global Electronic Supply Chain. The proceedings are exclusively available as a download — NO HARD COPY IS AVAILABLE. Released April 2018.

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