Products
Presentation by Karl Dietz, Ph.D., DuPont at the Technology Interchange meeting at EIT in Endicott, N.Y. Contains powerpoint slides and recorded presentation. Includes overview, capabilities, challenges and advances of laser direct imaging techniques, photolithography and etching. Also includes problems in etching and how to minimize them. Excellent 37 minute non-commercial tutorial on the subject...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards