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IPC J-STD-004D standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. IPC J-STD-004D standard may be used for quality control and procurement purposes.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards