IPC-J-STD-005 - Standard Only
Requirements for Soldering Pastes
This is the Japanese language version of J-STD-005.
Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.