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This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages. Released July 1994.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
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IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards