Products
Free Review This updated full-color, 18 x 24-inch wall poster visually defines minimum/maximum Class 3 through hole solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards