"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of...
IPC-7352: Generic Guideline for Land Pattern Design
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
J-STD-005B: Requirements for Soldering Pastes
IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
IPC-1782B: Standard for Manufacturing and Supply Chain Traceability of Electronic Products